Glass sealing thermistor sealing material (Dumet wire) and chip welding method
The resistance of the thermistor changes with the temperature change, The resistance of the lead resistance will not change with temperature, Therefore, the circuit debugging. The resistance of the lead resistance or external non-thermistor is negligible.
Many customers will ask glass seal NTC thermistor lead what is the material. Here we have to introduce specific thermistor NTC glass seal models: MF51 (diode type) and MF58 (SMD type) used for the Dumex wire metal wire material. Wherein the glass sealed patch MF58 thermistor is Mrs magnesium wire terminals, Du magnesium wire and thermistor glass shell expansion coefficient is very close, It plays a dual role in sealing and conductive.
Glass seal thermistor using Du magnesium wire material analysis:
The model is 0. 585 - 1. 400mm
Filament power: 15-60 (W)
Applicable voltage: 220/36/12/6 (V)
Applicable lamp current: 1 ~ 20 (A)
Applicable pipe diameter: 0. 15 ~ 0. 6 (mm) Dumet wire is a bimetallic material,
Its expansion coefficient of expansion coefficient of metal and copper core component ratio corresponding to, When Dumet wire is sealed to a particular glass, By adjusting the copper content of Dumet wire to achieve good sealing with the purpose of the glass, At the same time glass seal NTC thermistor after sealing a good annealing is necessary, In order to achieve good sealing Dumet wire and glass, Pay attention to several key issues that may cause chronic air leaks,
1, NTC thermistor chip and the degree of integration of core wire;
2, the bonding strength of copper oxide and copper interface;
3, the composition of the surface layer of boron and the wettability of the glass;
4, Dumet wire and thermal resistance of the heart chip welding process.
Dumet wire in the process, Using multi-layer plating, Nickel plating method to change the resistivity and thermal conductivity, And thus can be used for thin glass sealing, Will not produce cracks. By changing the composition of the chip metal and copper to adjust the expansion coefficient of purpose, In the boron treatment, the control adjust the temperature, time, speed and other parameters, To obtain the desired oxide structure and content.
A method of soldering a chip and a lead of a thermistor, To prevent the glass seal thermistor leakage. Comprising the following steps:
1, the lead molding, And then insert the chip into the row.
2, start the ladder-type hot air welding machine, Low-temperature preheating zone, high temperature preheating zone, Welding zone and heat preservation zone heating up to set temperature;
3, insert the thermistor chip line in turn into low-temperature preheat zone and high temperature preheating area for preheating; The preheated chip and wire are then sent to the pad. The hot air blown by the hot air torch melts the solder on the lead wire, While the lead and chip welding firmly;
4, welding a good thermistor and then into the thermal insulation treatment; After the heat treatment, the products are sent to the outside of the furnace and cooled to room temperature. After self-checking and cleaning, Drying into the next process (epoxy resin package).ent;After the heat treatment, the products are sent to the outside of the furnace and cooled to room temperature. After self-checking and cleaning, Drying into the next process (epoxy resin package).
Yaxun electronic invention in the full preheat and then welding, Welding products by insulation and then slowly cooling. The thermistor chip does not quench, Will not make the thermistor chip micro-cracks, Maintain the lasting reliability of products; And to ensure that the thermistor resistance to voltage reduction is small.
Many customers will ask glass seal NTC thermistor lead what is the material. Here we have to introduce specific thermistor NTC glass seal models: MF51 (diode type) and MF58 (SMD type) used for the Dumex wire metal wire material. Wherein the glass sealed patch MF58 thermistor is Mrs magnesium wire terminals, Du magnesium wire and thermistor glass shell expansion coefficient is very close, It plays a dual role in sealing and conductive.
Glass seal thermistor using Du magnesium wire material analysis:
The model is 0. 585 - 1. 400mm
Filament power: 15-60 (W)
Applicable voltage: 220/36/12/6 (V)
Applicable lamp current: 1 ~ 20 (A)
Applicable pipe diameter: 0. 15 ~ 0. 6 (mm) Dumet wire is a bimetallic material,
Its expansion coefficient of expansion coefficient of metal and copper core component ratio corresponding to, When Dumet wire is sealed to a particular glass, By adjusting the copper content of Dumet wire to achieve good sealing with the purpose of the glass, At the same time glass seal NTC thermistor after sealing a good annealing is necessary, In order to achieve good sealing Dumet wire and glass, Pay attention to several key issues that may cause chronic air leaks,
1, NTC thermistor chip and the degree of integration of core wire;
2, the bonding strength of copper oxide and copper interface;
3, the composition of the surface layer of boron and the wettability of the glass;
4, Dumet wire and thermal resistance of the heart chip welding process.
Dumet wire in the process, Using multi-layer plating, Nickel plating method to change the resistivity and thermal conductivity, And thus can be used for thin glass sealing, Will not produce cracks. By changing the composition of the chip metal and copper to adjust the expansion coefficient of purpose, In the boron treatment, the control adjust the temperature, time, speed and other parameters, To obtain the desired oxide structure and content.
A method of soldering a chip and a lead of a thermistor, To prevent the glass seal thermistor leakage. Comprising the following steps:
1, the lead molding, And then insert the chip into the row.
2, start the ladder-type hot air welding machine, Low-temperature preheating zone, high temperature preheating zone, Welding zone and heat preservation zone heating up to set temperature;
3, insert the thermistor chip line in turn into low-temperature preheat zone and high temperature preheating area for preheating; The preheated chip and wire are then sent to the pad. The hot air blown by the hot air torch melts the solder on the lead wire, While the lead and chip welding firmly;
4, welding a good thermistor and then into the thermal insulation treatment; After the heat treatment, the products are sent to the outside of the furnace and cooled to room temperature. After self-checking and cleaning, Drying into the next process (epoxy resin package).ent;After the heat treatment, the products are sent to the outside of the furnace and cooled to room temperature. After self-checking and cleaning, Drying into the next process (epoxy resin package).
Yaxun electronic invention in the full preheat and then welding, Welding products by insulation and then slowly cooling. The thermistor chip does not quench, Will not make the thermistor chip micro-cracks, Maintain the lasting reliability of products; And to ensure that the thermistor resistance to voltage reduction is small.
